Welcome:Beijing Plink Ai Technology Co.,LTD.Service Hotline:+86-400-127-3302
Language: Chinese ∷  English

NVIDIA Jetson Developer System

  • Y-C17-DEV Developer System
  • Y-C17-DEV Developer System
  • Y-C17-DEV Developer System
Y-C17-DEV Developer SystemY-C17-DEV Developer SystemY-C17-DEV Developer System

Y-C17-DEV Developer System

Board size:85mm*63mm*35mm
Power input: DC +12V ~ +24V
Working temperature: -40 ~ +65℃
Weight: 125g

Y-C17-DEV is based on the Plink AI development system driven by NVIDIA Jetson Xavier™ NX、NVIDIA Jetson ORIN™ NX and NVIDIA Jetson ORIN™ NANO modules. All the components on the board are of wide temperature type, the main interface is designed for electrostatic safety protection, and the power supply application scheme of high reliability is adopted. The input power supply has the functions of overvoltage and reverse polarity protection, and has a variety of external interfaces. It can also carry hundreds of functional modules through a MiniPCIe connector (including USB2.0 and PCIe X1 signals) to achieve further expansion of system functions. The M.2 B key slot of the Y-C17 carrier board can directly carry 4G/5G communication modules, and the carrier board has a Nano SIM card slot.


2 x Type-Cconnector

1 x NanotypeSIM card connector

1 xfull lengthMiniPCIeconnector

1 x M.22230M keyslot

1 x M.2 3050 B keyslot(Expandable 4G/5G communication module)

1 x 2 Lane MIPI camera interface FPC connector

1 x 3.3V RTCpower supply port

1 xFan control interface(5V)

Automatic power on

Anti-shedding power supply terminals

Board size:85mm * 63mm * 35mm

Power input: DC  +12V~+24V

Working temperature: -40 ~ +65℃

Weight: 125g



Interface display of carrier board



NVIDIA Jetson Orin NX/NVIDIA Jetson Orin Nano module

technical specification


Jetson Orin NX 16GB
Jetson Orin NX 8GB

Jetson Orin Nano 8GB

Jetson Orin Nano 4GB

Jetson Xavier NX 16GB

Jetson Xavier NX 8GB
AI Perf
100 TOPS
70 TOPS
40 TOPS
20 TOPS
21 TOPS

GPU

1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores
1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores
512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores
384-core NVIDIA Volta™ architecture GPU with 48 Tensor Cores

CPU

8-core Arm® Cortex®-A78AE v8.2 64-bit CPU
2MB L2 + 4MB L3
6-core Arm® Cortex®-A78AE v8.2 64-bit CPU
1.5MB L2 + 4MB L3
6-core Arm® Cortex®-A78AE v8.2 64-bit CPU
1.5MB L2 + 4MB L3
6-core NVIDIA Carmel Arm®v8.2 64-bit CPU
6MB L2 + 4MB L3

Memory

16GB 128-bit LPDDR5
102.4GB/s
8GB 128-bit LPDDR5
102.4GB/s
8GB 128-bit LPDDR5
68 GB/s
4GB 64-bit LPDDR5
34 GB/s
16GB 128-bit LPDDR4x
59.7GB/s
8GB 128-bit LPDDR4x
59.7GB/s

Storage

-
(Supports external NVMe)
16GB eMMC 5.1
Video Encode
1x 4K60 (H.265)
3x 4K30 (H.265)
6x 1080p60 (H.265)
12x 1080p30 (H.265)
1080p30 supported by 1-2 CPU cores
2x 4K60 (H.265)
4x 4K30 (H.265)
10x 1080p60 (H.265)
22x 1080p30 (H.265)

Video Decode

1x 8K30 (H.265)
2x 4K60 (H.265)
4x 4K30 (H.265)
9x 1080p60 (H.265)
18x 1080p30 (H.265)
1x 4K60 (H.265)
2x 4K30 (H.265)
5x 1080p60 (H.265)
11x 1080p30 (H.265)
2x 8K30 (H.265)
6x 4K60 (H.265)
12x 4K30 (H.265)
22x 1080p60 (H.265)
44x 1080p30 (H.265)

CSI Camera

Up to 4 cameras (8 via virtual channels***)
8 lanes MIPI CSI-2
D-PHY 2.1 (up to 20Gbps)
Up to 4 cameras (8 via virtual channels***)
8 lanes MIPI CSI-2
D-PHY 2.1 (up to 20Gbps)
Up to 6 cameras
(24 via virtual channels)
14 lanes MIPI CSI-2
D-PHY 1.2 (up to 30 Gbps)

PCIe

1 x4 + 3 x1
(PCIe Gen4, Root Port, & Endpoint)
1 x4 + 3 x1
(PCIe Gen3, Root Port, & Endpoint)
1 x4 (PCIe Gen4) + 1 x1 (PCIe Gen3)

USB

3x USB 3.2 Gen2 (10 Gbps)
3x USB 2.0
3x USB 3.2 Gen2 (10 Gbps)
3x USB 2.0
1x USB 3.2 Gen2 (10 Gbps)
3x USB 2.0

Power

10W - 25W
10W - 20W
7W - 15W
7W - 10W
10W - 20W
Mechanical 69.6mm x 45mm
260-pin SO-DIMM connector